Every BriefAsia story tagged Hbm, newest first.
September's semiconductor landscape saw Intel raise CPU prices while memory inventories contracted under pressure from high-bandwidth memory and server requirements.
South Korean memory maker plants team near Nvidia and AMD headquarters as competition for advanced HBM4 shifts to co-design partnerships
AI chip demand and HBM production squeeze advanced-node availability, giving the South Korean chipmaker room to negotiate higher rates
The Onyang facility will combine high-bandwidth memory production with advanced packaging as the chipmaker races to catch SK hynix in the AI memory market.
Advanced packaging capacity and memory allocation emerge as the new constraints in the semiconductor race, outpacing even foundry availability
Samsung and SK Hynix are pulling experienced designers from fabless firms and design houses, creating a skills vacuum across the semiconductor ecosystem
The AI memory architecture that powers today's chips faces growing skepticism from industry leaders who see fundamental limitations ahead
The South Korean giant is considering shifting conventional DRAM and NAND packaging from domestic fabs to Southeast Asia, a move that would unlock lines for advanced memory production
The Korean chipmaker's sixth-generation high-bandwidth memory production has reached near-80% efficiency, putting it back in the race for AI chip dominance.
New 3D memory architectures and processor-memory integration aim to ease data movement constraints as AI workloads scale
The South Korean giant has brought HBM4 production yields near 80%, signaling a shift in competitive dynamics from technology development to manufacturing scale and supply reliability.
MonolithIC 3D has triggered a second ITC investigation targeting the Korean chipmaker's advanced memory products, adding federal court claims to the battle
Samsung and Micron capture larger gains from conventional memory price surges while SK Hynix loses market share despite HBM leadership, as 2027 capacity sells out across the sector
The South Korean memory chipmaker accelerates its US manufacturing footprint with an advanced packaging plant designed to serve hyperscale customers closer to home.
New HBF specification targets the performance gap between HBM and SSDs as AI workloads demand faster, larger memory solutions
Korean chipmaker shows prototypes of stacked-on-logic HBM and bonded NAND architecture targeting AI infrastructure demands
The Korean chipmaker's new memory architecture aims to deliver eight times the performance of upcoming HBM5 standard
UBS forecasts the Korean chipmaker will capture 41% of global HBM shipments next year, driven by aggressive HBM4 rollout and Nvidia qualification wins
E-commerce giant cites single input cost as driver behind $20 billion increase in infrastructure investment
