Intel Partners With Chinese Glassmaker on Next-Generation Chip Packaging
The collaboration with Lens Technology targets glass substrate technology to boost interconnect density and power efficiency in future computing platforms
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The collaboration with Lens Technology targets glass substrate technology to boost interconnect density and power efficiency in future computing platforms

South Korean electronics giant winds down operations at its oldest mainland production facility as it reshapes Asia footprint

China's largest display panel manufacturer signals strategic pivot into advanced packaging, optoelectronics, and new energy sectors

The Binzhou facility marks China's latest push into high-purity specialty gases critical for semiconductor etching and chamber cleaning

A new investigation proposes uniform 12.5 percent tariffs on 60 economies, including China, despite vast differences in labor practices and manufacturing scale.