Technology·Sep 8, 2026
JCET Eyes $968 Million to Scale AI Packaging Lines
China's largest outsourced assembly house plans private placement to triple HPC and memory capacity as domestic chip ecosystem accelerates
By Tran Quoc Bao · 3 min ·
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Advanced Packaging
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Technology·Sep 1, 2026
Integrated Systems Will Drive Next Wave of AI Growth, Says TSMC
As inference workloads surge 500-fold since 2022, the chipmaker is betting on packaging innovation and system-level integration to power industrial AI deployment
By Cheng Wei-Lun · 4 min ·
Technology·Aug 24, 2026
India's Semiconductor Push Extends to Supply Chains and Advanced Manufacturing
After securing fab commitments, the country now faces the harder work of building yields, materials infrastructure, and technical expertise to compete globally.
By Priyanka V. Rao · 4 min ·
Technology·Aug 21, 2026
Samsung Breaks Ground on $4.3 Billion HBM Packaging Plant in South Korea
The Onyang facility will combine high-bandwidth memory production with advanced packaging as the chipmaker races to catch SK hynix in the AI memory market.
By Cheng Wei-Lun · 4 min ·
Technology·Aug 20, 2026
Memory Shortage Eclipses Chip Manufacturing as AI Industry Bottleneck
Advanced packaging capacity and memory allocation emerge as the new constraints in the semiconductor race, outpacing even foundry availability
By Cheng Wei-Lun · 4 min ·
Technology·Aug 18, 2026
Samsung Eyes R&D Facility Conversion to Boost Foundry Output
The Korean chipmaker is exploring a pivot that would turn research infrastructure into production capacity amid AI-driven memory demand
By Cheng Wei-Lun · 2 min ·
Technology·Aug 17, 2026
Toppan Pushes for Higher FC-BGA Substrate Prices as Japan Capacity Doubles
Japanese packaging giant leverages tight supply and expanded Niigata output to negotiate margin improvements with chip clients
By Cheng Wei-Lun · 3 min ·
Technology·Aug 16, 2026
SK Hynix Breaks Ground on $3.9 Billion Chip Packaging Facility in Indiana
The South Korean memory chipmaker will hold its ceremony in West Lafayette on August 27, advancing its US footprint in AI-driven high-bandwidth memory production.
By Cheng Wei-Lun · 3 min ·
Technology·Aug 14, 2026
Rapidus Projects Eight-Reticle Interposers as Chip Packaging Hits Scale Limits
Japan's semiconductor venture sees advanced packaging pushing beyond conventional wafer economics as chiplet architectures and memory bandwidth demands grow
By Cheng Wei-Lun · 3 min ·
Technology·Aug 14, 2026
Taiwan Emerges as Critical Hub for Co-Packaged Optics Manufacturing
Ayar Labs CEO argues the industry question has shifted from technical proof to commercial scalability, with Taiwan's packaging ecosystem positioned as the solution
By Cheng Wei-Lun · 3 min ·
Technology·Aug 12, 2026
TSMC's Advanced Packaging Capacity Catches Up With AI Chip Demand
After years of doubling CoWoS production annually, the foundry giant is finally closing the gap on surging orders for high-end AI accelerators.
By Cheng Wei-Lun · 3 min ·
Technology·Aug 10, 2026
India Expands Chip Strategy Beyond Fabrication Into Packaging and Workforce
New investments from ASIP, Dixon, and Rashi signal a shift toward higher-value manufacturing and deeper localization across India's semiconductor ecosystem.
By Priyanka V. Rao · 3 min ·
Technology·Aug 9, 2026
TSMC Shifts CoW Packaging Work to Third-Party Contractors as AI Demand Strains Capacity
The Taiwanese chipmaker is outsourcing a key stage of its advanced packaging process to OSAT providers, signaling infrastructure pressure in the AI semiconductor supply chain.
By Cheng Wei-Lun · 3 min ·
Technology·Aug 9, 2026
Ajinomoto Lifts Forecast as AI Server Demand Drives Semiconductor Material Sales
The Japanese materials supplier's upgraded outlook reflects how advanced packaging growth is creating new revenue opportunities in specialized substrate components
By Cheng Wei-Lun · 3 min ·
Technology·Aug 8, 2026
TSMC Brings 3nm Chipmaking and Advanced Packaging to Japan Expansion
The Taiwanese semiconductor giant is deepening its Kumamoto presence with cutting-edge production capabilities and sensor technology partnerships
By Cheng Wei-Lun · 3 min ·
Technology·Aug 6, 2026
SK Hynix Sets Late-August Groundbreaking for $3.9 Billion Indiana Packaging Facility
The South Korean memory chipmaker accelerates its US manufacturing footprint with an advanced packaging plant designed to serve hyperscale customers closer to home.
By Cheng Wei-Lun · 4 min ·
Technology·Aug 5, 2026
German Equipment Maker Manz Expands Into Taiwan's Advanced Packaging Hub
The company is establishing an R&D center in Tainan Science Park to develop next-generation tools for AI and high-performance computing markets
By Cheng Wei-Lun · 4 min ·
Technology·Aug 5, 2026
Hanwha Semitech Eyes FOPLP Revenue as TCB Tools Lift Q2 Earnings
South Korean equipment maker pivots to advanced packaging, with panel-level tools set to generate sales from Q3 2026 after thermocompression bonding profitability returns
By Cheng Wei-Lun · 3 min ·
Technology·Aug 4, 2026
Semiconductor Battle Moves Beyond Chip Scaling as AI Demands Reshape Industry
Advanced packaging and system integration emerge as new competitive fronts while transistor miniaturization slows
By Cheng Wei-Lun · 3 min ·
Technology·Aug 3, 2026
South Korea's Chip Exports Shift to Taiwan as AI Demand Fuels Advanced Packaging Rush
High-bandwidth memory from Korean fabs increasingly heads to TSMC facilities for integration into AI accelerators, reshaping regional semiconductor trade flows.
By Cheng Wei-Lun · 3 min ·
Technology·Aug 1, 2026
ASE Technology Raises 2026 Capex to Record $10.5 Billion on AI Packaging Demand
Taiwan's largest semiconductor packaging and testing firm lifts spending target for the second time this year, signaling accelerating infrastructure build-out for advanced AI chip assembly.
By Cheng Wei-Lun · 3 min ·