Every BriefAsia story tagged Advanced Packaging, newest first.
Japan's state-backed chipmaker expands its northern fab complex with advanced packaging and testing infrastructure to support domestic semiconductor ambitions
South Korean memory giant recruits US engineers to co-design stacked DRAM-on-logic architectures with American chip clients, pushing custom memory beyond data centers into on-device AI.
The partnership includes prepayment for domestic capacity as advanced packaging becomes the critical bottleneck in AI hardware supply chains
South Korean chipmaker expands die-to-wafer bonding capacity for HBM and logic production as equipment negotiations continue
Malaysia-based semiconductor packager targets SGX debut as AI-driven demand reshapes Asian chip supply chains
The memory chipmaker is pouring capital into its Cheongju P&T7 facility while maintaining its broader KRW 19 trillion investment envelope, betting on surging AI-driven demand for high-bandwidth memory.
The world's third-largest LCD panel maker joins BOE and other Chinese display manufacturers in pivoting upstream toward semiconductors as the industry seeks revenue diversification.
China's largest display panel manufacturer signals strategic pivot into advanced packaging, optoelectronics, and new energy sectors
Biren and Enflame unveil 1,024-GPU optical interconnects and glass-based packaging at Shanghai conference as Beijing's chip strategy shifts from standalone accelerators to cloud-scale systems
Hanmi Semiconductor and Hanwha Semitech face off over thermocompression bonding technology as demand for high-bandwidth memory accelerates across Asia's chip sector
As transistor scaling hits physical limits, chipmakers turn to advanced packaging innovation to sustain AI accelerator performance gains
