Intel Partners With Chinese Glassmaker on Next-Generation Chip Packaging
The collaboration with Lens Technology targets glass substrate technology to boost interconnect density and power efficiency in future computing platforms
Every BriefAsia story tagged Intel, newest first.

The collaboration with Lens Technology targets glass substrate technology to boost interconnect density and power efficiency in future computing platforms

The chipmaker's third-quarter forecast of up to $16.8 billion exceeded analyst estimates by $1.7 billion, driven by 59 percent jump in data center sales

Second-quarter 2026 results show data-center expansion lifting the chipmaker's turnaround, though foundry business remains unproven

Chinese cloud providers lock in long-term processor contracts as Intel and AMD shipments tighten, marking a shift from once-stable supply chains to semiconductor-style allocation.

Fresh layoffs in Data Center Group signal continued restructuring under CEO Lip-Bu Tan, even as hyperscalers expand AI infrastructure across Asia-Pacific

South Korean chipmaker issues formal disclosure refuting reports of negotiations for Intel's under-construction New Albany facility

The Taiwan foundry giant's wafer cost increases signal sustained AI demand and could open pricing flexibility for Intel and rivals

As transistor scaling hits physical limits, chipmakers turn to advanced packaging innovation to sustain AI accelerator performance gains