JCET Eyes $968 Million to Scale AI Packaging Lines
China's largest outsourced assembly house plans private placement to triple HPC and memory capacity as domestic chip ecosystem accelerates
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China's largest outsourced assembly house plans private placement to triple HPC and memory capacity as domestic chip ecosystem accelerates

As inference workloads surge 500-fold since 2022, the chipmaker is betting on packaging innovation and system-level integration to power industrial AI deployment

Defense Ministry selects IOWN technology to link radar, sensors, and command centers across Self-Defense Forces installations nationwide

New infrastructure guidelines arrive as Nvidia's next-generation platforms push thermal and electrical limits in data centers across Asia

AM Intelligence places binding order for 9,000 Vera Rubin systems as Asia races to secure scarce computing capacity amid multi-year backlogs

Samsung and SK hynix strengthen negotiating position as rising chip prices push server manufacturers to notify hyperscalers of double-digit increases for 2027 deliveries

As hyperscalers build larger AI clusters, the capacity to move data between accelerators at scale is becoming as critical as securing GPUs and memory

Senior director outlines shift from single AI models to collaborative agent teams as compute demands escalate toward space-based infrastructure

Gaon Cable's US subsidiary will supply power distribution systems for a 250-megawatt facility as Asian manufacturers tap North America's infrastructure buildout

The Onyang facility will combine high-bandwidth memory production with advanced packaging as the chipmaker races to catch SK hynix in the AI memory market.

Taiwan-based robotics maker targets semiconductor and server production lines with 100kg combined lifting capacity, banking on non-China supply chain advantage

Gulf states and Southeast Asian nations are turning infrastructure investment and market access into a strategic partnership worth billions, reshaping regional technology flows.